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Chip on Board

COB -Al wire bond – Gold 0.1 microns 100 million PCBs since 2002

PTH on Rigid PCBs up to 0.15mm thickness

  • Good PR in bond area

  • Hole location is ~ 50 microns

  • Good bondability > 11 gms pull.

  • Good solderablity – no black shadow  qty  7 million / yr

 

COB for leading SWISS module manuf.
– 0.3 microns soft Gold Plate

  • No bus line required to gold plate

  • Under layer nickel is ductile – additive free

  • Plating thickness 0.2mic to 4 microns

  • Reliable “al” bonding from 0.05 microns and “gold wire” from 0.3 microns